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Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO

By Levi LiJuly 16, 2026 · 1 min read

Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics …

Merck executives (left to right): Benedikt Ernest, SVP; Ben Hein, CEO of Electronics; David Mueller, head of Electronics Strategy. Credit: DIGITIMES Generative AI is accelerating demand for computin…

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